You are correct about the environment of the MEMS being a sealed environment. I have worked in the semiconductor industry for a long time and although back purging a chip is not impossible is unlikely. I do agree that there is little if any oxidation in the MEMS.
The connectors that do exist between the compass and the board it connects with is not soldered. It may be captured (I have not looked at it) but is still subject to micro vibrations and oxidation. I've seen this phenomenon literally thousands of times. Board to board connections, chip to socket connections and cable to board connections, take your pick. This would explain why replacing the compass fixed the problem. My guess is if the original compass were reinstalled, the result would be the same outcome. By removal and replacement of the connector, would serve the same purpose of the micro vibrations caused by the "belly slap".
It's just my opinion but the belly slap is not a scientific principal.
I am just trying to offer a plausible explanation. [emoji12]